PLANERLITE 4000 SERIES - CMP Slurry


Fujimi's PLANERLITE 4000 series of CMP polishing slurries are designed for use on SiO2 films (interlayer dielectric/ILD, shallow trench isolation/STI). Based on ultra-high purity colloidal silica or fumed silica, it is availalbe in several grades with varying additives and abrasive particle concentration. This enables you, the end user, to select the product optimal for your specific process parameters and cost/performance requirements.

Product Stats:

Category:
Chemical Mechanical Planarization

Application:
ILD Polish, Interlayer Dielectric (ILD), Chemical Mechanical Planarization (CMP), STI Polish, Shallow Trench Isolation (STI), SiO2 Films

Type:
CMP Slurry, Polishing Slurry

Material:
Colloidal Silica, Fumed Silica


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