Fujimi's PLANERLITE 6000 series of CMP polishing slurries are designed for use on polysilicon applications. There are a variety of types available in either polishing slurry based on ultra-high purity colloidal silica or rinsing agent with special additives which keeps the post-polishing wafer surface hydrophilic. The polishing slurry, in all types, has extremely high polysilicon removal rate with excellent selectivity to silicon oxide film. The rinsing agent helps prevent particle adhesion, simplifying the wafer cleaning process. The entire line can be used at high dilutions, and adjustment of the dilution provides control of removal rate and selectivtity while also deliverying high performance for the cost. Abrasive particles are completely dispersed, eliminating sedimentation in a highly stable slurry.