PLANERLITE 7000 SERIES - CMP Slurry


Fujimi's PLANERLITE 7000 series of CMP polishing slurries are designed specifically for Copper (Cu) metallization in the damascen process. Based on ultra high purity colloidal silica with special additives, this line delivers high copper removal rate, with excellent selectivity to barrier metal. As a result, erosion is low and residual copper on the barrier metal is minimal, making it completely stable, with no sedimentation and minimal scratching. We also offer a high-dilution type, contributing to lower cost for the copper damascene process.

Product Stats:

Category:
Chemical Mechanical Planarization

Application:
Copper (Cu) Damascene, Chemical Mechanical Planarization (CMP), Copper (Cu) Polish

Type:
Polishing Slurry, CMP Slurry

Material:
colloidal silica


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