PLANERLITE 8000 SERIES - CMP Slurry


Fujimi's PLANERLITE 8000 series of CMP polishing slurries are designed specifically for barrier metal in the Copper (Cu) interconnection. Based on ultra pure colloidal silica with special dditives, it delivers enough barrier metal removal rate with planarity to keep designed selectivity. In addition, our 8000 series of PLANERLITE deliver minimal scratch and roughness, providing an ideal polishing slurry.

Product Stats:

Category:
Chemical Mechanical Planarization

Application:
Chemical Mechanical Planarization (CMP), Barrier Metal Polish

Type:
CMP Slurry

Material:
colloidal silica