PLANERLITE 5000 SERIES - CMP Slurry


Fujimi's PLANERLITE 5000 series of CMP polishing slurries are applied exclusively to metal wiring or plugs used for the circuits of VLSI (Very-Large-Scale Integration) devices. The synergistic effect of the mechanical polishing function of ultra-pure colloidal silica and the chemical functions of special additives enables planarization of circuit metals with a high removal selectivity gainst oxidized films. The PLANERLITE 5000 series is a high performance slurry that produces fewer scratches compared to conventional alumina slurries and reduces dishing problems caused by chemical etching.

Product Stats:

Category:
Chemical Mechanical Planarization

Application:
VLSI Device Polishing

Type:
Polishing Slurry, CMP Slurry

Material:
Colloidal Silica