COMPOL is a colloidal silica slurry developed especially for polishing metals, ceramics, and electronic substrates such as lithium tantalate (LiTaO3), lithium niobate (LiNbO3), and sapphire. With excellent particle uniformity and dispersal, it delivers a high removal rate and damage-free polishing.
COMPOL-50AD and COMPOL-50S combine colloidal silica slurry with special organic amines that produce a high-removal-rate for primary and secondary polishing of silicon wafers. Even at high dilutions, COMPOL delivers excellent processing efficiency and long slurry life.
Typical Physical Properties of COMPOL
|Content of SiO2||pH||Specific Gravity||Average Particle Size (nm)|
|20||40||9.2||1.300||15.0||Sapphire, CaF2, BGO, LiTaO3, LiNbO3, and other oxide crystals|