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Fujimi Presents EHS Friendly Slurries at 20th CAMP 2016




Posted August 25, 2016

The Fujimi group presented a study titled, "EHS Friendly Slurries with High Poly Si Removal Rate and Nearly Zero ILD Loss" at the 20th International Symposium on Chemical-Mechanical Planarization in August, 2016. The study was co-authored by Haiyan Li, Akira Endou, Annette Schaper, Todd Eck, Toshio Shinoda, and Anne Miller who represent a mix of researchers from Fujimi Corporation and Fujimi Incorporated.