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Presentation: Settling of Colloidal Silica Particles in CMP Slurry




Posted March 22, 2017

Fujimi Corporation's Senior Product Development Chemist, Dr. Jie Lin, presented a paper at China Semiconductor Technology International Conference, CSTIC 2017 (March 12-13 in Shanghai, China). The paper is titled "Settling of Colloidal Silica Particles in CMP Slurry: Monitoring, Effect, and Handling", co-authored by Jie Lin and W. Scott Rader.