The Latest Fujimi News

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Fujimi Corporation Recognized as Environmental Partner

Posted April 29, 2014

In a special ceremony April 23, Clean Water Services (CWS) honored Fujimi Corporation with an Industrial Partners Pretreatment Award for achieving a perfect compliance record in 2013. The company’s diligence complements the efforts of the greater Washington County community to act as responsible stewards of the Tualatin River Watershed. Thirty-nine Washington County industries—from microchip manufacturers to food processors—received awards for efforts made in 2013 to kee...

Fujimi Corporation Presents at ICPT 2013

Posted January 2, 2014

Dr. Jie Lin of Research & Development, presented a poster at the 10th International Conference on Planarization/CMP Technology, ICPT 2013 (Oct. 30 to Nov. 1, 2013 in Hsinchu, Taiwan).  Titled "Effect of Pad Hardness on Planarization Efficiency of Selected Features in Cu CMP", it is co-authored by Jie Lin and Charles Poutasse. ICPT is the annual conference covering all aspects of Chemical-Mechanical Planarization (CMP).  ICPT was founded by a co-operation of the CMP...

Clarkson University Center for Advanced Materials Processing Organizes 18th Annual International Symposium on Chemical-Mechanical Planarization

Posted September 5, 2013

Source:  Clarkson University Press Release - 9/4/2013 More than 100 researchers from several high- technology companies, including Fujimi staff, suppliers and universities from the United States, Japan, Korea, China, Taiwan, Belgium, and Canada, gathered in Lake Placid, N.Y., in August for the 18th International Symposium on Chemical-Mechanical Planarization (CMP), sponsored by Clarkson University’s Center for Advanced Materials Processing (CAMP). Read more on the CAMP...

High and Low Selectivity SiC(N) Slurry Development

Posted August 21, 2013

Fujimi Corporation scientist, Hooi-Sung (Brian) Kim made a presentation on the development of high and low selectivity slurry for Silicon Carbonitride at the CAMP 2013 meeting held in Lake Placid, NY, August 12th, 2013.  The presentation highlighted both the development of the CMP slurry and the post-polish surface analysis on SiC(N) surfaces.  The entire development and analysis was done through a collaboration of Research and Development staff from both Fujimi Corporation and our ...

Samsung Starts Mass Producing Industry’s First 3D Vertical NAND Flash

Posted August 14, 2013

Samsung has announced that it has begun mass producing the industry’s first three-dimensional (3D) Vertical NAND (V-NAND) flash memory, which breaks through the current scaling limit for existing NAND flash technology. Achieving gains in performance and area ratio, the new 3D V-NAND will be used for a wide range of consumer electronics and enterprise applications, including embedded NAND storage and solid state drives (SSDs).   Read more at
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